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Applied Materials, Inc. (AMAT) has introduced two advanced chipmaking systems designed to enable atomic-scale precision in the world’s most sophisticated logic chips.
The technologies are aimed at meeting the surging demands for AI computing while enhancing performance and energy efficiency across next-generation processors.
The new systems address the semiconductor industry's push to build faster and more efficient transistors amid the growth of AI infrastructure. Modern Gate-All-Around (GAA) transistors at 2nm and below promise significant performance gains, but constructing their intricate 3D structures requires over 500 highly precise processing steps.
By controlling material deposition at the atomic level, Applied Materials’ platforms enable chipmakers to overcome extreme complexity while maintaining performance standards.
Following the announcement, Applied Materials’ stock traded over 7% higher in Wednesday’s premarket. On Stocktwits, retail sentiment around the stock changed to ‘neutral’ from ‘bullish’ territory the previous day amid ‘normal’ message volume levels.
The Precision Selective Nitride PECVD system strengthens shallow trench isolation (STI), a crucial technique for preventing electrical interference between transistors. By depositing silicon nitride only where needed and at low temperatures, the system maintains trench integrity across hundreds of processing steps.
This reduces leakage, ultimately improving device performance per watt. Leading logic chipmakers at 2nm GAA nodes have already started implementing this system, the company said.
Meanwhile, the Trillium ALD system focuses on precision metal deposition within the complex GAA transistor gate stacks.
“Our industry is entering a period of rapid, non‑linear change, where traditional lithographic chip scaling alone is no longer sufficient.”
-Prabu Raja, President, Semiconductor Products Group at Applied Materials
AMAT stock has gained over 50% year-to-date.
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